Name
Vendor
Type
Applicable PWB Type
Applicable Post-Flux
Solder Resistance
260C/20 sec.

Probimer 52
CIBA Geigy
Solvent Develop
-Au Plating
-SMOBC
Rosin Type
Aqeous, No-clean

PSR-400
TAIYO
Aqueous Develop
SMOBC
Organic Coat
Rosin Type
Aqeous, No-clean

TAIYO
Aqueous Develop
Au Plating

Rosin Type
No-Clean

Post-Flux

Yes

Yes

Yes

Non-Cleaning Kester K1515

4H

7H

7H

Surface Insulation Resistance

5 x10 12

5 x10 12

5 x10 12

Minimum Web

.005

.003

.005

Producability

Fair

Good

Poor

Thickness (um) on Line

10-20

5.0-15.0

8-20

Thickness (um) on Material

15.0-70.0

15.0-70.0

20-80

Minimum Clearance

100 um

75 um

75 um

Applicable Board Thickness

.031-.157

.010-.300

.010-.300