Feature PCB Board Construction

Preferred

Special

Maximum Board Size

20 x 22

22 x 26

Maximum Board Thickness

.126

.300

Minimum Board Thickness

.031

>.014

Tolerance of Board Thickness

+/- 10% or +/- .006

+/- 7% or +/- .003

Minimum Dielectric Thickness

.002

.0012

Tolerance of Dielectric Thickness

+/- 10%

.0005

Maximum Number of Layers

24

24+

Copper Foil Thickness

Inner Layer

.25, .5, 1, 2 oz.

3.4 oz.

Outer Layer

1-2 oz.

up to 6 oz.

Hole

Minimum Drilled Hole Size

.025

.006

Maximum Aspect Ratio

6

10

Plated - Thru. Size Tolerance

Bare Copper

+/- .002

+/- .001

Hole Positional Accuracy

+/- .003

+/- .002

Line and Pad

Minimum Line Width

.005

.003

L/W Tolerance

+/- .0015

+/- .0005

Minimum SMD Pad Pitch

.015

.005

Minimum SMD

.008

.005

SMD Pad Size Tolerance

+/- .0015

+/- .0005

Plating

Copper Thickness

.0001~

Plated

Ni

.0001~

Au (Hard)

.00004~

Au (Soft)

.000012~

Au (Electoroless)

.000003 ~ .000015

.000005 ~ .000010

Registration (Hole to Layer)

Internal Layer

.004

.003

External Layer

.004

.003

Solder Mask

S/M Web

Wet Mask

.008

.007

LPI Mask

.005

.003

S/M Thickness

Wet Mask

.0002 ~ .0004 on trace

.0098 ~ .0012 on raw material

LPI Mask

.0002 ~ .0008 on trace

.0012 ~ .0020 on raw material

S/M Registration

Wet Mask

+/- .006

+/- .004

LPI Mask

+/- .003

+/- .002

Fabrication

Dimensional Tolerance

+/- .005

+/- .003

Hole to Card Edge Tolerance

+/- .006

+/- .004

Warp & Twist

1.0%

.5%

V-Grooving Positional Accuracy

+/- .010

+/- .005

Bare Board Test

Voltage of Test

40V

500V

Resistance for Short

10M

100M

Resistance for Open

2M

100M

Maximum Board Size

20x24

24x26