Design

External Layers
(1/2 oz. copper clad, .062 finished thickness)

Minimum
Feature Size

Preferred

Feature Size

Trace Width

.003

.005

Trace to Trace Spacing

.003

.005

Trace to Pad Spacing

.003

.005

Trace to Plane Spacing

.003

.008

Trace to Unplated Hole

.010

.014

Trace to NC Routed Edge

.010

.020

Trace to Punched Edge

.062

.062

Trace to Scored Edge

.012

.020

Trace to Misc Metal Features (Logo, UL Marking, etc.)

.004

.020

Pad to Pad Spacing

.003

.005

Pad Size = FHS + (x.xxx)

.008

.015

Via Pad Size = FHS +(x.xxx)

.006

.015

Via Pad to Via Pad Spacing. Tented

.003

.005

Via Pad to Via Pad Spacing. No tent with S/M lay down.

.010

.012

Pad to Plane Spacing

.005

.008

Pad to NC Routed Edge

.012

.020

Pad to Punched Edge

.062

.062

Pad to Scored Edge

.012

.020

Unplated Hole Edge to Board Edge

.015

.050

Unplated Hole Edge to Unplated Hole Edge. </= .070 FHS

.010

.016

Unplated Hole Edge to Unplated Hole Edge. >/= .070 FHS

.010

.016

Internal Layers (Signals) (1 oz. copper clad, .062 finished thickness)

Trace Width

.003

.005

Trace to Trace Spacing

.003

.005

Trace to Pad Spacing

.003

.005

Trace to Plane Spacing

.005

.006

Trace to Unplated Hole

.010

.012

Trace to Routed Edge

.020

.024

Trace to Punched Edge

.062

.062

Trace to Scored Edge

.020

.024

Trace to Misc Metal Features (Scales, Fiducials, etc.)

.004

.020

Pad to Pad Spacing

.004

.006

Pad Size = FHS + (x.xxx)

.010

.015

Via Pad Size = FHS +(x.xxx)

.010

.015

Via Pad to Via Pad Spacing

.003

.005

Pad to Plane Spacing

.005

.008

Pad to Routed Edge

.020

.024

Pad to Punched Edge

.062

.062

Pad to Scored Edge

.020

.024

Internal Layers (Planes) (1 oz. copper clad, .062 finished thickness)

Plane Clearance = FHS + (x.xxx)

.020

.025

Pad Size = FHS + (x.xxx)

.010

.015

Plane to NC Routed Board Edge

.020

.030

Plane to Scored Edge

.020

.030

Connection Annular Ring = Drill + (x.xxx)

.005

.006

Solder Mask Clearance

Liquid Photo Imagable

Pad Size = External Pad + (x.xxx)

.003

.005

Pad Size = Unplated Hole + (x.xxx)

.005

.020

Min. Width (Webbing)

.003

.005

Positional Tolerance

no s/m on pad

</= 20% on pad

Legend

Minimum Height

.040

.060

Minimum Stroke Width

.005

.006

Legend to Solder Mask Clearance Edge

.005

.010

Legend to Board Edge

.010

.020

Preferred Practices

Hole per Square Inch

100 Maximum

Number of Drill Size

none

none

Via Pad Tear Dropping on all Signal Connections

no

via pads

Breakaway Slot Width

.031

.062

Breakaway Slot Web Width

.020

.040

Smallest Internal Radius

.016

.031

Etched SMT Pad Tolerance

+/- .0010

+/- .0020

Nonfunctional pads on Internal Signals

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