Data Transfer Methods:

• FTP via the Web

• FTP via your software
• Modem: 714-546-0659
• E-mail: sales@ace-pcb.com
• Floppy disk
• Zip disk
• CD-ROM

Data Format Files Accepted:

• ODB ++
• 274D Gerber
• 274X Gerber
• IPCD356 Net List
• Mentor Neutered Net List
• HPGL
• DXF
• PDF
• TIFF
• DWG
• NC Drill
• Excellon

Panel Sizes:

• 6 x 9 through 21 x 26
• Maximum image size 19 x 24

Construction:

• Balanced
• Controlled dielectric
• Controlled impedance +/- 5%
• Blind and buried via
• Minimum thickness .004
• Maximum thickness .300
• Maximum layers 34+

Line and Space:

• Minimum line .003
• Minimum space .003

Laminates and Materials:

• Die-functional
• Tetra-functional
• Multifunctional Tg 170
• Polyimide
• PTFE/Rogers/Gore
• Lead free/Halogen free
• Full range of specialty laminates
• Minimum cladding 1/4-oz.
• Maximum Internal copper 4oz with UL certification
• Maximum outer layer cladding 6oz + plating
• Minimum core thickness .002
• Maximum core thickness .059

Product Types:

• 1 and 2-sided
• Multi-layers
• Surface mount
• Chip on board
• Ball grid array
• Multi-chip module
• Flip Chip

Drilling:

• Minimum drilled hole .006
• Minimum pad size over finished hole size: internal .008, external .008

Solder Mask and Legend Inks:

• Per IPC-SM-840
• Dry film
• Liquid photo imagable
• S/M colors: green, red, blue, black, yellow, orange, and clear
• Legend inks: white, red, yellow, blue, black and orange

Surface Finish:

• Hot air solder level
• Electroless nickel/gold
• Full body nickel/gold
• Selective nickel/gold
• Organic surface preservative
• Immersion Tin/Silver
• NI/AU/PD

Fabrication:

• Single and array panel
• Beveling
• Countersink and counter bore
• Edge milling
• Scoring
• Controlled depth drilling

Electrical Test:

• 1 and 2-sided SMD
• Dual access net list
• Flying probe to 10 mil pitch

Laboratory Testing:

• Thermal stress cross sections
• Ionic contamination testing
• TDR impedance verification
• Dielectric spacing verification
• Tg and FTIR